Burn-in and testing methods of semiconductor wafers and burn-in boards used therein

摘要

(Configuration) A semiconductor wafer is divided into test blocks including several of the integrated circuits formed thereon, and it is determined to which portion of the original wafer the integrated circuit included in the test block is placed in each of the divided test blocks And the carrier to which the ID code is assigned are each provided with a plurality of sockets which are fitted and detached freely, and each of the block of the object is placed on each of the carriers. In this way, The carriers are fitted into corresponding sockets to perform burn-in and test.;(Effect) The defect analysis of the semiconductor wafer can be performed from the obtained test result, the position information of each block of the object, and the ID code assigned to each carrier.