Micro-sensor for determn. of thermal flux density and thermal flow throughput

摘要

The microsensor involves a wall (3) situated between rooms at different temps. (T1,T2), where difference of temp. is produced between the centre and edge of a SiO2 - Si3N4 combination layer diaphragm (2) spanning a cavity (11) in a silicon wafer (1) on a thin copper sheet (9). A thin-film thermopile (4), formed pref. by photolithography with a "hot" contact in the middle of the diaphragm and a "cold" contact above the remaining blocks of silicon, is covered by a SiO2 insulating coating (7) 100 nm thick, on which a pref. meander-line heating film (8) of e.g. nickel-chromium is deposited. A pref. thin-film resistive temp. sensor (10) is integrated into the diaphragm.