Method and appts. for soldering electronic components using paste solder and preheat and reflow in oven

摘要

A method and apparatus for soldering an electronic component uses paste solder in an oven (10) of non-closed structure which allows inflowing of amhient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section (22) into the oven to keep a dehumidified atmosphere in the oven and prevent the activity of flux contained in the paste solder from deterorating. Nitrogen may also he added to the incoming air. IMAGE