system for fliessfertigung of micro structure and thin layer semiconductor device on extended substrate

摘要

A method of fabricating semiconductor devices on a moveable fiber includes the steps of moving the fiber longitudinally along a predetermined pathway, applying a semiconductor material to at least a portion of the surface of the fiber at a first station along the pathway, applying a resist over the semiconductor material at a second station spaced from the first station in a direction of movement of the fiber, pre-baking the resist at a third station spaced from the second station, exposing a predetermined semiconductor device pattern in the resist at a fourth station spaced from the third station, developing the exposed resist at a fifth station along the pathway, etching or depositing the predetermined pattern on the material over which the exposed resist was located at a sixth station along the pathway, and removing the remaining resist from the semiconductor material at a seventh station along the pathway. Additionally, an eighth station could be provided for cutting the fiber into selected lengths for later assembly into bundles or combinations for the construction of electrical apparatus. IMAGE