Assembly apparatus for assembling a product comprising a plurality of common and non-common parts

• 1. 用于跨越多个组装单元自动生成公共测量的方法 [P] . 中国专利： CN108701237B . 2022.01.18
• 2. 用于跨越多个组装单元自动生成公共测量的方法 [P] . 中国专利： CN108701237A . 2018-10-23
• 3. Assembly system for assembling product comprising a plurality of parts [P] . 美国专利： US5724724A . 1998-03-10

  机译： 用于组装包括多个零件的产品的组装系统

• 4. Assembly system for assembling product comprising a plurality of parts [P] . 美国专利： US5727301A . 1998-03-17

  机译： 用于组装包括多个零件的产品的组装系统

• 5. Assembly system for assembling product comprising a plurality of parts [P] . 英国专利： GB9406330D0 . 1994-05-25

  机译： 用于组装包括多个零件的产品的组装系统

• 1. Assembly language and assembler for deep learning accelerators [J] . Lan Huiying, Wu Linyang, Han Dong, 高技术通讯（英文版） . 2019,第004期
• 2. The Electrochemical Characteristics of Multilayer Assembly of Hemoglobin and Polystyrene Sulfonate at Self-assembled Monolayer Surface [J] . 中国化学快报（英文版） . 2000,第001期
• 3. Single-Period Multi-Product Assemble-to-Order Systems with Common Components and Uncertain Demand Patterns [C] . Yongbo Xiao, Jian Chen, Chung-Yee Lee MANUFACTURING SERVICE OPERATIONS MANAGEMENT . 2007
• 4. A MODERN TRAGEDY OF THE NON-COMMONS: AGRO-INDUSTRIAL CHANGE AND EQUITY IN BRAZIL'S BABASSU PALM ZONE. (VOLUMES I AND II) (ECONOMIC DEVELOPMENT, AGROFORESTRY, LIVESTOCK, SUBSISTENCE CROPS) [D] . MAY, PETER HERMAN 1986
• 5. Self‐Assembly: Targeted Therapy against Metastatic Melanoma Based on Self‐Assembled Metal‐Phenolic Nanocomplexes Comprised of Green Tea Catechin (Adv. Sci. 5/2019) [O] . Ke Li, Gao Xiao, Joseph J. Richardson, 2019
• 6. Self-Assembly: Targeted Therapy against Metastatic Melanoma Based on Self-Assembled Metal-Phenolic Nanocomplexes Comprised of Green Tea Catechin (Adv. Sci. 5/2019) [O] . Ke Li, Gao Xiao, Joseph J. Richardson, 2019

• 1. On the Non-Common Neighbourhood Energy of Graphs [J] . Ahmad N. Al-Kenani ,Anwar Alwardi ,Omar A. Al-Attas . 应用数学（英文） . 2015,第8期
• 2. CONCURRENT PRODUCT PORTFOLIO PLANNING AND MIXED PRODUCT ASSEMBLY LINE BALANCING [J] . BRYAN April ,HU S Jack ,KOREN Yoram . 中国机械工程学报 . 2007,第001期
• 3. New IC package, assembly technique by means of a "blind" alignment "flip-chip" method and assembling facilities [J] . Vladimir V. Novikov . 电子与封装 . 2004,第004期
• 4. 低成本高速,为稀薄/轻量的组件组装包括裸晶 [C] . Ken Ball ,Charles Gutentag . 2007年中国国际表面贴装和微组装技术大会 . 2007
• 5. 公共产品与公共管理——公共管理视角的公共产品供给问题研究 [A] . 席恒 . 2006