Adaptable load board assembly for testing ICs with different power/ground bond pad and/or pin configurations

摘要

An adapter unit configurable for testing ICs having different power and ground contact configurations is customized for one of such configuration and mounted on a load board having first and second plurality of signal contacts, wherein respective pairs of the first and second plurality of signal contacts are connected to both a contact of the IC and a test channel from an IC tester. The adapter unit is mounted on the load board making contact with the first plurality of signal contacts, while a DUT board holding the IC is mounted on the load board making contact with the second plurality of signal contacts. The adapter unit includes a plurality of signal contacts respectively connected to the first plurality of signal contacts of the load board, a power bus ring connected to a power line provided by the IC tester, and a ground bus ring connected to a ground line from the IC tester. The adapter unit is configured for a specific power and/or ground contact configuration by providing power jumpers connecting each of the signal contacts of the adapter unit connected to power contacts of the IC being tested to the power bus ring while the test channel connected to that signal contact is inactive, and by providing ground jumpers connecting each of the signal contacts of the adapter unit connected to ground contacts of the IC being tested to the ground bus ring while the test channel connected to that signal contact is inactive.