THERMOELECTRIC CONVERSION FUNDAMENTAL ELEMENT, THERMOELECTRIC CONVERSION MODULE, LAMINATED THERMOELECTRIC CONVERSION DEVICE THERMOELECTRIC GENERATION SUBUNIT AND GENERATION SYSTEM

摘要

PURPOSE: To conduct a fixing of thermoelectric conversion fundamental elements to metal segments using screws and to prevent the cleavage and the breaking of the fundamental elements from being generated by a method wherein a semiconductor element material chip, which is a single crystal consisting of a (Bi, Sb)₂(Te, Se)₃ semiconductor compound and has a shape factor set at a specified value or lower, is jointed to one pair of metallic materials holding both end surfaces of the chip between them. ;CONSTITUTION: A thermoelectric conversion fundamental element 10 has a disc-shaped semiconductor element material chip 11 jointed to one pair of metal blocks 12 holding both end surfaces of the chip 11 between them. It is desirable that the chip 11 has a shape factor (the plate thickness/the sectional area of an element material) of 1 or less. A screw is screwed into a screw hole 12a bored in each metal block 12 along the almost central axis of the chip 11 to reinforce the weakness of the mechanical strength of the chip 11. A thermoelectric conversion element has three metal segments 14 arranged with two fundamental elements 10n and 10p interposed between one sheet of the segment 14 and two segments 14, two through holes 14a which correspond to the holes 12a bored in the blocks 12, provided in the segments 14, and the elements 10n and 10p fixed to the segments 14 by four fixing screws 15.;COPYRIGHT: (C)1996,JPO