Production manner null of etched circuit substrate and transcription sheet and etched circuit substrate for etched circuit substrate

摘要

PURPOSE: To make the cutting or the cracks in a circuit pattern hard to occur by bringing at least a part of the circuit pattern of a corner part into the resin in a circuit board. ;CONSTITUTION: The circuit pattern of a corner part 6 at the circuit pattern 16 has branched paths 17, which are branched into two fork shapes at both outsides. The parts of the branched paths 17 are not exposed on the surface of a circuit board 4 of the corner part 6 but brought into the resin constituting the circuit board 4. In the manufacturing method, a circuit board transfer sheet 10 is applied approximately along a cavity surface 23 of a movable metal mold 23, and a part to be bent 11 is located at a recess bent part 23a of the cavity surface 23. Fused resin is injected into a cavity 26. Thus, the branched path 17 of the circuit pattern 16 is peeled from a carrier sheet 12, and at least a part is brought into the fused resin. The circuit board 4 is formed as a unitary body together with the circuit pattern 16. Thereafter, the carrier sheet 12 is removed from the circuit board 4.;COPYRIGHT: (C)1995,JPO