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Sputter module for modular wafer processing equipment
Sputter module for modular wafer processing equipment
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机译:用于模块化晶圆加工设备的溅射模块
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摘要
A sputter coating module for a multifunction processing machine is provided in which the supporting mechanism for the workpiece can be isolated from the sputtering source, the pumps and other processing apparatus for cleaning without exposing the entire machine to atmosphere. The supporting mechanism which is rotatable from the horizontal to the vertical is hollow and mounted on hollow vacuum-sealed trunnions to allow passage of water, argon, and dry-nitrogen or air at atmospheric pressure into the interior of the supporting mechanism.
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