BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Teflon film adhering apparatus for adhering Teflon films to each other. More specifically, the present invention relates to a Teflon film adhering apparatus for minimizing heat generated during bonding of a Teflon film, will be.;To this end, the Teflon film 7 is adhered to the base 1 and the slider 2 by incorporating the heaters 3 and 4 to raise and lower the slider, respectively, according to the heat generated by the heater. A transformer (9) for transforming the transformer (8) to the heater (3) (4), a power switch (10) for switching the power supplied to the transformer, and a controller And a timer 11 for supplying the same to the transformer 9.
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