LAMINATED THIN-FILM CIRCUIT USING TEFLON PFA OR TEFLON FEP AS DIELECTRIC INSULATOR AND ITS MANUFACTURING METHOD

摘要

PURPOSE: To reduce a dielectric ratio and to achieve stabilization by providing a dielectric insulation layer that is made of Teflon-type material being supported by a substrate, electrically connecting the parts of a conductive circuit layer that is supported in the dielectric insulation layer each other, and electrically connecting the part of the circuit layer to an external device. ;CONSTITUTION: A conductive circuit layer 16a is formed on a flat surface 14 of a substrate 12. Then, a plurality of post biases 18a are formed on the surface of the conductive circuit layer 16a and are electrically connected. Then, an insulation dielectric layer 20a that is made of dry-powder-shaped Teflon PFA is applied onto the conductive circuit 16a and the post bias 18a, thus completely covering the conductive circuit 16a and the post bias 18a and burying them into a dielectric layer. The process is repeated for a plurality of times, thus forming a multilayer circuit array 10. Then, the circuit array 10 is connected to an external device by a bond pad 22, thus achieving an extremely low dielectric ratio and retaining stability.;COPYRIGHT: (C)1994,JPO