首页> 外国专利> Wafer flat zone aligner with semiconductor wafer damage detection means and wafer damage detection method using the same

Wafer flat zone aligner with semiconductor wafer damage detection means and wafer damage detection method using the same

机译:具有半导体晶片损伤检测装置的晶片平坦区对准器和使用该晶片对准器的晶片损伤检测方法

摘要

A flat zone aligner is disclosed that can align flat zones of a wafer while detecting damages occurring at the wafer edges.;The present invention relates to a wafer flat zone aligner in which a plurality of semiconductor wafers are vertically arranged at regular intervals on a pair of rollers installed parallel to an upper surface of a carrier, and then the wafers are rotated to align the flat zones of the wafers. Damage detection means for detecting whether the edge of the wafer is damaged in a predetermined position adjacent to is configured to be installed.;Therefore, the damage of the wafer is accurately detected along with the flat zone alignment of the wafer, thereby preventing damage to other wafers in advance, thereby improving productivity.
机译:公开了一种能够对准晶片的平坦区域同时检测在晶片边缘处发生的损伤的平坦区域对准器。技术领域本发明涉及一种晶片平坦区域对准器,其中多个半导体晶片以规则的间隔垂直地布置在一对半导体晶片上。平行于载体的上表面安装的多个辊,然后旋转晶片以对准晶片的平坦区域。用于检测晶片的边缘是否在邻近的预定位置被损坏的损坏检测装置被配置为安装。因此,与晶片的平坦区域对准一起精确地检测到晶片的损坏,从而防止对晶片的损坏。预先处理其他晶片,从而提高生产率。

著录项

  • 公开/公告号KR970030560A

    专利类型

  • 公开/公告日1997-06-26

    原文格式PDF

  • 申请/专利权人 김광호;

    申请/专利号KR19950042320

  • 发明设计人 김상학;전일환;박병석;홍성현;

    申请日1995-11-20

  • 分类号H01L21/66;

  • 国家 KR

  • 入库时间 2022-08-22 03:17:26

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