Package with adhesive resin spill preventing dam on top of die pad

摘要

The present invention relates to a semiconductor package, in which a dam is formed on a top surface of a die pad of a lead frame to prevent an adhesive generated during a die bonding process from overflowing to an inner lead portion, It is possible to change only the lead frame without changing the damper, and furthermore, there is an advantage that the dam can be used as a ground cover.