CLAIMS What is claimed is: 1. An integrated circuit package encapsulated by a molding material containing fibers and a method of manufacturing the same.

摘要

A capsule integrated circuit package 40 is disclosed herein by fibers 56 or other molding material 54 containing such particles. The package (40) includes a support member (44) for supporting the IC chip (44). And electrically interconnects the conductive leads 52 defined by the bonding wires 48. The IC chip 44, the bonding wire 48, and the portion of the support member 46 are encapsulated by the entirety of the fiber-containing molding material 54. In the method of the present invention, the intermediate assembly comprising the IC chip 44, the support member 46 and the bonding wire 48 supports the assembly in the mold cavity to form the fibers 56 or other such particles Is encapsulated by pouring a modifying material 54 into the cavity and around the assembly. Molds containing a unique movable gate are also disclosed herein.