Copolyamide, a process for the preparation of a polyamide film and the film is used as a hot melt adhesive film

摘要

Copolyamides having a m.pt. of 100-140 deg C and a melt index (DIN 735) of 5-50 g/10 minutes at 160 deg C, are made from a combination of: (a) 40-95 wt.% of an equimolar mixt. of piperazine and dodecanedicarboxylic acid, and (b) 60-5 wt.% 12-aminododecanoic acid and/or 11-aminoundecanoic acid. Also claimed are: (i) a method for preparing a polyamide foil by extrusion of the copolyamides; and (ii) use of the polyamide foils as high m.pt. foils.