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High performance and high capacitance package with improved thermal dissipation
High performance and high capacitance package with improved thermal dissipation
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机译:高性能和高电容封装,改善了散热
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摘要
A thermally dissipative IC package which can accommodate large discrete capacitors. The package substrate incorporates a recessed region on one of its surfaces which is separate from the region in which the IC device is placed. Inside this recessed region is placed a discrete capacitor such that the entire capacitor resides below the surface of the substrate within the recessed region. Finally, a metal plate is attached to the surface of the substrate, unencumbered by the discrete capacitor.
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