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Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use

机译:电解生产用于电镀锡的磺酸铅和磺酸锡的方法

摘要

An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive &agr; particle counts of less than 0.1 CPH/cm.sup.2.
机译:一种用于生产磺酸铅和锡的电解方法,该方法包括向电解池中的阳极和多个阴极施加DC电压,从而将铅或锡溶解在电解液中。电解池由阳离子交换膜和阴离子交换膜分隔为阳极室和阴极室。电解液是有机磺酸的溶液,阳极是铅或锡。该方法将放射性同位素如铀和th的含量降低到小于50ppb的水平,因此,根据本发明通过使用铅和锡盐的焊料镀敷形成的涂层显示出放射性。颗粒计数小于0.1 CPH / cm.sup.2。

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