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Electrolytic process for the preparation of lead sulfonate and tin sulfonate for use in lead / tin plating baths

机译:电解方法制备用于铅/锡电镀液的磺酸铅和磺酸锡

摘要

An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode (2) and a plurality of cathodes (4) in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes (5,6) into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive α particle counts of less than 0.1 CPH/cm2.
机译:一种用于生产磺酸铅和锡的电解方法,该方法包括向电解池中的阳极(2)和多个阴极(4)施加DC电压,然后将铅或锡溶解在电解溶液中。电解池由阳离子交换膜和阴离子交换膜(5,6)分隔成阳极室和阴极室。电解液是有机磺酸的溶液,阳极是铅或锡。该方法将放射性同位素如铀和th的含量降低到小于50 ppb的水平,因此,根据本发明,使用铅和锡盐通过焊料镀敷形成的涂层显示出的放射性α颗粒数小于0.1 CPH /平方厘米

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