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Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus
Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus
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机译:包括散热销的内部引线键合(ILB)装置和使用该装置的ILB方法
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摘要
An inner lead bonding apparatus having a heat dissipation plate attached to inner leads and to a support for upholding a lead frame of a tape automated bonding package. The heat dissipation plate is, during performance of an inner lead bonding process, located near the bonding interface of bumps formed on a semiconductor chip or on the inner leads and the inner leads, and includes a fastener for fixing itself to the support and elliptical bolt holes for enabling its contact position to the inner leads to be controllable.
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