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Thin film transistors and method of promoting large crystal grain size in the formation of polycrystalline silicon alloy thin films

机译:薄膜晶体管及在形成多晶硅合金薄膜时促进大晶粒尺寸的方法

摘要

A thin film transistor includes, a) a thin film source region; b) a thin film drain region; c) a polycrystalline thin film channel region intermediate the thin film source region and the thin film drain region; d) a transistor gate and gate dielectric operatively positioned adjacent the thin film channel region; and e) the thin film channel region comprising at least an inner layer, an outer layer and a middle layer sandwiched between the inner layer and the outer layer, the inner layer and the outer layer comprising polycrystalline silicon and having respective energy bandgaps, the middle sandwich layer comprising a polycrystalline material and having a lower energy bandgap than either of the inner and outer layers. Alternately, the channel region is homogeneous, comprising germanium or an alloy of polycrystalline silicon and germanium. A method of increasing the size of individual crystal grains in a polycrystalline silicon alloy includes, a) providing germanium atoms within a layer of polycrystalline silicon to form a polycrystalline silicon-germanium alloy; and b) heating the polycrystalline silicon-germanium alloy to an effective temperature for an effective period of time to cause individual polycrystalline silicon grains within the alloy to increase their size from prior to the heating step.
机译:薄膜晶体管包括:a)薄膜源极区;以及b)薄膜漏区; c)在薄膜源区和薄膜漏区之间的多晶薄膜沟道区; d)可操作地位于薄膜沟道区附近的晶体管栅极和栅极电介质; e)薄膜沟道区,至少包括内层,外层和夹在该内层和外层之间的中间层,该内层和外层包括多晶硅并具有各自的能带隙,中间包含多晶材料并且具有比内层和外层中的任一个都低的能带隙的夹层。或者,沟道区是均质的,包含锗或多晶硅和锗的合金。一种增加多晶硅合金中单个晶粒尺寸的方法,包括:a)在多晶硅层中提供锗原子以形成多晶硅锗合金; b)将多晶硅-锗合金加热到有效温度并持续有效的时间,以使合金中的各个多晶硅晶粒从加热步骤之前开始增大其尺寸。

著录项

  • 公开/公告号US5665981A

    专利类型

  • 公开/公告日1997-09-09

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US19960755152

  • 发明设计人 SANJAY BANERJEE;SHUBNEESH BATRA;

    申请日1996-11-22

  • 分类号H01L29/76;H01L31/036;H01L31/112;

  • 国家 US

  • 入库时间 2022-08-22 03:09:29

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