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ANALYSIS OF POLYCRYSTALLINE SILICON THIN FILMS WITH DIFFERENT GRAIN SIZE

机译:不同晶粒度的多晶硅硅薄膜的分析

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Grain size of polycrystalline silicon (poly-Si) thin films fabricated by atmospheric pressure chemical vapor deposition (APCVD) can be controlled by an intermittent source gas supply method. An increase of grain size ( up to around 20 urn in our case) decreases the density of micro defects and dislocations, improving the crystalline order of the poly-Si thin films. We also tried to improve the crystalline order at the poly-Si grain boundaries or within the grain itself by a high temperature (750 ℃) annealing, which had pronounced effect on the peak position and FWHM of TO-BE peak in photoluminescence (PL) spectra. PL spectroscopy was shown to be a powerful method for investigation of the quality of polycrystalline Si thin films, but measurement of the Hall effect mobility has shown that this annealing temperature was too high. We then tried to characterize the samples annealed at lower temperatures (300℃) and compared the effects of different annealing atmospheres (hydrogen, water vapor).
机译:通过大气压化学气相沉积(APCVD)制造的多晶硅(poly-Si)薄膜的晶粒尺寸可以通过间歇源气体供应方法来控制。晶粒尺寸的增加(在我们的案例中为20 um左右)降低了微缺陷和位错的密度,从而改善了多晶硅薄膜的晶序。我们还尝试通过高温(750℃)退火来改善多晶硅晶界或晶粒内部的晶序,这对光致发光(PL)中TO-BE峰的峰位置和FWHM有明显影响光谱。 PL光谱被证明是研究多晶硅薄膜质量的有效方法,但是霍尔效应迁移率的测量表明该退火温度太高。然后,我们试图表征在较低温度(300℃)下退火的样品,并比较了不同退火气氛(氢气,水蒸气)的影响。

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