Method of designing mask pattern or direct depicting pattern on a wafer for forming a semiconductor integrated circuit and design rule confirmation method

摘要

A method for designing mask patterns or direct depicting patterns using CAD for forming a semiconductor integrated circuit including a plurality of laminated semiconductor layers includes inputting design rules for performing a design rule check (DRC) of n patterns, where n is an integer larger than 2, n mask layers, or n direct depicting patterns for forming n semiconductor layers; editing the input design rules into matrix notation; designing patterns for the n mask layers or n respective semiconductor layers; displaying the designed patterns on a CRT; performing a DRC of the patterns using the design rules edited into the matrix notation; modifying the checked patterns to satisfy the design rules edited into the matrix notation; and outputting the design rules and the modified patterns. The efficiency of the confirmation and setting of the design rules can be enhanced, reducing design mistakes.