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SILVER-SILVER CHLORIDE REFERENCE ELECTRODE AND ITS MANUFACTURE
SILVER-SILVER CHLORIDE REFERENCE ELECTRODE AND ITS MANUFACTURE
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机译:银-氯化银参比电极及其制造
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摘要
PROBLEM TO BE SOLVED: To improve the stability at the time of immersion in a water solution containing chlorine and to prevent a fault in characteristics due to chromium-/titanium elution which occurs in a conventional adhesion layer, by changing a part of a silver pattern into silver chloride from the side surface after an insulating layer for adhesion causing no electrochemical reaction, a conductive pattern to be an electrode, the silver pattern and an insulating layer are formed on a substrate. ;SOLUTION: An SiO2 layer is formed on the surface of a prescribed silicon substrate as a substrate 1, for instance, by a prescribed wet oxidation. Next, a photosensitive polymer layer for adhesion is formed as an insulating layer 2 on the substrate 1. Formation of a film on the whole surface by sputtering gold, patterning by a photoresist, etching of the gold and removal of the photoresist are conducted, so as to form a conductive pattern 3, and a silver layer is formed on the whole surface thereof by sputtering silver of a prescribed thickness. Next, a photosensitive polymer layer is formed as an upper insulating layer 5 by a prescribed processing and a polyimide layer is formed only in a part wherein a silver pattern 4 is to be left. Then, a silver chloride layer is formed from the peripheral part of the silver pattern 4 by a prescribed processing and thereby a silver chloride pattern 6 is formed.;COPYRIGHT: (C)1998,JPO
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