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Silver-silver chloride reference electrode and a method of manufacturing the same

机译:银-氯化银参比电极及其制造方法

摘要

PROBLEM TO BE SOLVED: To improve the stability at the time of immersion in a water solution containing chlorine and to prevent a fault in characteristics due to chromium-/titanium elution which occurs in a conventional adhesion layer, by changing a part of a silver pattern into silver chloride from the side surface after an insulating layer for adhesion causing no electrochemical reaction, a conductive pattern to be an electrode, the silver pattern and an insulating layer are formed on a substrate. ;SOLUTION: An SiO2 layer is formed on the surface of a prescribed silicon substrate as a substrate 1, for instance, by a prescribed wet oxidation. Next, a photosensitive polymer layer for adhesion is formed as an insulating layer 2 on the substrate 1. Formation of a film on the whole surface by sputtering gold, patterning by a photoresist, etching of the gold and removal of the photoresist are conducted, so as to form a conductive pattern 3, and a silver layer is formed on the whole surface thereof by sputtering silver of a prescribed thickness. Next, a photosensitive polymer layer is formed as an upper insulating layer 5 by a prescribed processing and a polyimide layer is formed only in a part wherein a silver pattern 4 is to be left. Then, a silver chloride layer is formed from the peripheral part of the silver pattern 4 by a prescribed processing and thereby a silver chloride pattern 6 is formed.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:通过改变一部分银图案,提高浸入含氯水溶液中时的稳定性,并防止由于传统的粘附层中铬/钛溶出而导致的特性缺陷。在没有引起电化学反应的粘附的绝缘层之后,从侧面形成氯化银,在基板上形成作为电极的导电图案,银图案和绝缘层。 ;解决方案:例如,通过规定的湿式氧化在规定的硅基板作为基板1的表面上形成SiO 2 层。接下来,在基板1上形成用于粘附的光敏聚合物层作为绝缘层2。通过溅射金,通过光致抗蚀剂进行构图,金的蚀刻以及光致抗蚀剂的去除在整个表面上形成膜,因此形成导电图案3,并通过溅射规定厚度的银在其整个表面上形成银层。接下来,通过规定的处理将光敏聚合物层形成为上绝缘层5,并且仅在将保留银图案4的部分中形成聚酰亚胺层。然后,通过规定的处理,从银图案4的周边部分形成氯化银层,从而形成氯化银图案6。版权所有:(C)1998,JPO

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