MANUFACTURE OF YIG THIN FILM CHIP FOR MAGNETOSTATIC WAVE ELEMENT

摘要

PROBLEM TO BE SOLVED: To realize low cost by cutting a YIG thin film chip from a wafer which is formed in such a way that a magnetostatic wave element material of specified composition is liquid phase-epitaxial-grown on both surfaces of a garnet substrate, pasting a plurality of these chips one another, and cutting a substrate cross section of each chip at its center in a plane parallel to an epitaxial film surface. ;SOLUTION: A magnetostatic wave element material whose composition is expressed with R₃ (FeM)₅O₁₂ (R is at least an element of Bi, Y, La, and Gd, M is at least an element of Ga, Al and Sc) is liquid phase-epitaxial-grown on both surfaces of a garnet (GGG) substrate to form a wafer. After a YIG thin film chip for a magnetostatic wave element is cut from it, thin film surfaces of the chips are stuck to one another with wax. Then every chip is cut at the center of GGG substrate 2 of each chip 1 along a cutting line 4 at the same time, with a multi-edge cutter. The wax is melted after cutting, then the chip which has YIG thin film 3 formed on the front and back surfaces of the GGG substrate of each chip is obtained.;COPYRIGHT: (C)1998,JPO