CHIP SPAWN OF MUSHROOM, PACK SHEET FOR CHIP SPAWN AND PACKLESS CULTIVATION

摘要

PROBLEM TO BE SOLVED: To provide a chip spawn capable of producing a mushroom without deformation of deterioration and a pack sheet for the chip spawn of the mushroom forming the chip in a log cultivation of the mushroom and further provide a simple covering method for a placeless culture medium. SOLUTION: Wax 4 is coated on the surface of a chip in using a chip spawn 3 of a mushroom, the wax 4 is coated at the time of formation of the chip spawn 3 when using a pack sheet 1 and the wax 4 is coated on a periphery surface of the chip spawn 3 at a necessary time in a packless cultivation.