首页> 外国专利> ELECTRONIC DEVICE HAVING FLEXIBLE MUTUAL CONNECTION BY DOUBLE-METAL DUPLEX-STUD STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE HAVING FLEXIBLE MUTUAL CONNECTION BY DOUBLE-METAL DUPLEX-STUD STRUCTURE AND MANUFACTURING METHOD THEREOF

机译:具有双金属双螺柱结构的柔性相互连接的电子设备及其制造方法

摘要

PROBLEM TO BE SOLVED: To enhance the resistance against metal migration, by providing the constitution wherein a mutual connecting part and a capacitor include a first metal layer, a dielectric layer, and a second metal layer, and the connecting part of the mutual connecting part to the first metal layer and the second metal 11 layer and the connecting part of the capacitor to the first metal layer and the second metal layer are further included. ;SOLUTION: The formation of metal studs 32, 33 and 34 is performed at the same time as the pattern formation of a dielectric substance between levels. Then, the metal studs 32 and 33 are connected to only one of layers 17 and 15, respectively, so as to obtain a precision metal-metal capacitor. The stud 32 is connected to only an upper plate 22 and arranged at an arbitrary point upper than the capacitor. The stud 33 should come into contact with only a lower capacitor plate 21 from the upper side. Therefore, the position of the stud 33 is important in comparison with the above described two capacitors. Furthermore, the metal stud 34 in correspondence with the end terminal of the mutual connecting part is in contact with both layers 24 and 25 of the mutual connecting part.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:通过提供其中相互连接部分和电容器包括第一金属层,介电层和第二金属层以及相互连接部分的连接部分的构造来增强抗金属迁移的能力。第一金属层11和第二金属层11上的“第二电容器”和“电容器”与第一金属层和第二金属层的连接部分还包括在内。 ;解决方案:金属螺柱32、33和34的形成与层间电介质物质的图案形成同时进行。然后,将金属钉32和33分别仅连接到层17和15之一,以获得精密的金属-金属电容器。螺柱32仅连接到上板22,并且布置在比电容器高的任意点。螺栓33应仅从上侧与下部电容器板21接触。因此,与上述两个电容器相比,双头螺栓33的位置很重要。此外,与相互连接部分的末端端子相对应的金属螺柱34与相互连接部分的两个层24和25接触。;版权:(C)1998,JPO

著录项

  • 公开/公告号JPH1056063A

    专利类型

  • 公开/公告日1998-02-24

    原文格式PDF

  • 申请/专利权人 INTERNATL BUSINESS MACH CORP IBM;

    申请/专利号JP19970121130

  • 发明设计人 RYAN JAMES E;EL-KAREH BADIH;

    申请日1997-05-12

  • 分类号H01L21/768;H01L27/04;H01L21/822;H01L27/108;H01L21/8242;

  • 国家 JP

  • 入库时间 2022-08-22 03:04:19

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