INNER PERIPHERAL BLADE GRINDING STONE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce a warp value of a slide wafer, to extend a blade life, to improve a slice yield, to reduce a defective saw mark on the slider wafer and to reduce machining allowance (car floss). ;SOLUTION: An inner peripheral blade grinding stone is constituted by applying nickellating 16 on an opening inner marginal part of a base metal 15 and dispersing and burying diamond abrasive grains 17 on this nickel plating 16. An average grain diameter is to be about 5μm. A parallel part 18 is formed by grinding both side surfaces of an electrodeposited abrasive grain layer. The parallel part 18 is to be more than 100μm in the radial direction, and its surface roughness is to be less than 50μm in an Ra value. Consequently, a grain diameter of the abrasive grains 17 is unifomed and a rectilinear propagting property at the time of cutting is improved. A saw mark is hard to be made, and cutting efficiency is improved. A grinding stone life is improved. A warp average value of a slide wafer can be improved, and car floss can be reduced.;COPYRIGHT: (C)1998,JPO