METHOD FOR COOLING SUBSTRATE IN VACUUM FILM FORMING METHOD AND APPARATUS FOR COOLING SUBSTRATE IN VACUUM FILM FORMING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for cooling substrate in vacuum film forming method to lower the temp. of a hot glass substrate uniformly after forming films, thereby cooling without deforming or cracking the substrate. ;SOLUTION: The substrate cooling method after the vacuum forming of an amorphous Si film, Si nitride film, Si oxide film and Al, Cr or similar metal film or metal oxide or nitride films comprises the steps of feeding a hot glass substrate having formed films to a curing/take-up chamber having a thermostatic plate held at 50-300°C to cool the substrate to specified temp. in vacuum, feeding the air into this chamber to set it to the atmospheric pressure, and taking the substrate out from the chamber.;COPYRIGHT: (C)1998,JPO