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Bonder and automatic bonding device equipped with the same

机译:胶合机及配备该胶合机的自动胶合装置

摘要

PURPOSE:To expedite decision of by which of bonders a lead frame is bonded when a plurality of bonders are aligned to be used at a line. CONSTITUTION:A lead frame L/F which is bonded is contained in unloaders 1-3 provided at bonders C1-C3 themselves which bonded it. Even if a plurality of the bonders are assembled at a line, by which of the bonders the frame is bonded can be rapidly decided. When the unloaders 1-3 of the bonders C1-C3 are arranged near a position for receiving the frame and the plurality of bonders are aligned to be used at the line, the longitudinal order of them can be replaced without any disturbance.
机译:目的:为了更快地确定将多个键合器对齐以在一条线上使用时,引线框是通过哪个键合器进行键合。组成:被粘接的引线框架L / F包含在装订机C1-C3自身的装卸机1-3中,装卸机C1-C3本身将其粘合。即使在一条线上组装多个粘合剂,也可以快速确定框架是通过哪个粘合剂粘合的。当结合器C1-C3的卸载器1-3被布置在用于接收框架的位置附近并且多个结合器被对齐以在生产线上使用时,它们的纵向顺序可以被替换而没有任何干扰。

著录项

  • 公开/公告号JP2754111B2

    专利类型

  • 公开/公告日1998-05-20

    原文格式PDF

  • 申请/专利权人 KAIJOO KK;

    申请/专利号JP19920047699

  • 发明设计人 NOMURA HISASHI;

    申请日1992-02-05

  • 分类号H01L21/60;

  • 国家 JP

  • 入库时间 2022-08-22 03:01:39

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