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COOLER FOR CIRCUIT BOARD MODULE AND PORTABLE ELECTRONIC EQUIPMENT HAVING THE COOLER

机译:电路板模块冷却器和带有冷却器的便携式电子设备

摘要

PROBLEM TO BE SOLVED: To prevent disturbances to a wiring formed on a circuit board by providing a circuit board, which has a thermal conductive layer for radiation with a high thermal conductivity provided in an insulating layer, then forming an aperture for exposing the thermal conductive layer in the insulating layer, and conducting the heat of an electronic component mounted on the circuit board to the thermal conductive layer from the aperture. ;SOLUTION: A circuit board 23 is formed in a multilayer structure in which a thermal conductive layer 25 for radiation with a high thermal conductivity and a signal wiring layer 26 are buried in an insulating layer 24. On the surface of the circuit board 23, an aperture 34 is formed for exposing the thermal conductive layer 25 in the insulating layer 24 to a mounting portion of a TCP component 27. In addition, a metal plate (thermal conduction means) 35, having substantially the same size as a semiconductor ship 29 and having high thermal conductivity, is mounted in a buried state in the aperture 34 of the circuit board 23. When a personal computer is operated, the semiconductor chip 29 of the TCP component 27 is heated. In this case, the heat of the semiconductor chip 29 is conducted to the thermal conductive layer 25 in the insulating layer 24, through the metal plate 35 in the aperture 34 on the surface side of the circuit board 23.;COPYRIGHT: (C)1998,JPO
机译:要解决的问题:通过提供一种电路板来防止对形成在电路板上的布线的干扰,该电路板在绝缘层中具有导热率高的热传导层,然后在其上形成一个开口以暴露该热传导绝缘层中的绝缘层,并且将安装在电路板上的电子部件的热从孔传导到导热层。 ;解决方案:电路板23形成为多层结构,其中具有高热导率的辐射用导热层25和信号布线层26掩埋在绝缘层24中。在电路板23的表面上,形成有开口34,该开口34用于将绝缘层24中的导热层25暴露于TCP部件27的安装部分。此外,具有与半导体船29的尺寸基本相同的金属板(导热装置)35。具有高热导率的半导体器件以埋入状态安装在电路板23的孔34中。当操作个人计算机时,TCP组件27的半导体芯片29被加热。在这种情况下,半导体芯片29的热量通过电路板23的表面侧上的孔34中的金属板35传导到绝缘层24中的导热层25。 1998年

著录项

  • 公开/公告号JPH1098287A

    专利类型

  • 公开/公告日1998-04-14

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP19960248325

  • 发明设计人 YAHOTANI AKIHIKO;KAMIKAWA YOSHINORI;

    申请日1996-09-19

  • 分类号H05K7/20;G06F1/20;

  • 国家 JP

  • 入库时间 2022-08-22 03:01:22

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