COOLER, CIRCUIT MODULE HAVING THE COOLER, AND ELECTRONIC APPLIANCE

摘要

PROBLEM TO BE SOLVED: To provide a cooler which can efficiently conduct to a refrigerant the heat of a heat generating body such as a semiconductor package and can improve the ability whereby the heat generating body is cooled. SOLUTION: A cooler 15 has a heat-receiving portion 20 for receiving the heat of a semiconductor package 7, a heat-radiating portion 21 for radiating the heat of the semiconductor package, and pipe lines 22 for moving therethrough a liquid refrigerant between the heat receiving and radiating portions. The cooler transports the heat of a heat generating body which is conducted to the heat receiving portion to the radiating portion, by moving the refrigerant, based on the temperature difference between the heat receiving and radiating portions. Furthermore, at least the outer peripheral portions of the heat receiving portion, which are connected thermally with the semiconductor package is formed out of a soft thermally conductive sheet 26 of a rubber- form elastic body as to be brought into direct contact with the heat conducting sheet with the semiconductor package.