首页> 外国专利> COOLER FOR CIRCUIT MODULE AND PORTABLE ELECTRONIC APPARATUS EMPLOYING IT

COOLER FOR CIRCUIT MODULE AND PORTABLE ELECTRONIC APPARATUS EMPLOYING IT

机译:电路模块冷却器和便携式电子设备

摘要

PURPOSE: To provide a portable electronic apparatus in which the heat dissipation member and cover can be standardized while enhancing the cooling effect of circuit element. CONSTITUTION: The portable electronic apparatus comprises a circuit board 43 mounting a TCP and a hole 158 larger than the TCP is made through the circuit board. A cover 167 covering the TCP and lead is fixed to the rear of the circuit board and a heat dissipation member 166, having a protrusion touching the TCP, is fixed through the hole to the surface 43a of circuit board. The heat dissipation member is fixed detachably with a heat sink 201. The heat sink 201 comprises a heat dissipation panel 202 touching the heat dissipation member, a large number of heat dissipating protrusions 205 projecting from the heat dissipation panel 202, and a motor fan 220 supported on the heat dissipation panel 202 and introducing the cooling air to the surroundings of the heat dissipating protrusions 205.
机译:目的:提供一种便携式电子设备,其中可以使散热构件和盖标准化,同时增强电路元件的冷却效果。构成:便携式电子设备包括:电路板43,其安装有TCP;以及孔158,该孔158大于通过该电路板的TCP。覆盖TCP和引线的盖167被固定到电路板的后部,并且具有与TCP接触的突起的散热构件166通过该孔被固定到电路板的表面43a。散热构件与散热器201可拆卸地固定。散热器201包括与散热构件接触的散热面板202,从散热面板202突出的大量散热突起205和电动机风扇220。支撑在散热面板202上,并且将冷却空气引入到散热突起205的周围。

著录项

  • 公开/公告号JPH08307083A

    专利类型

  • 公开/公告日1996-11-22

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP19950105036

  • 发明设计人 SHIBAZAKI KAZUYA;ITO HIRONORI;OGAMI KEIZO;

    申请日1995-04-28

  • 分类号H05K7/20;G06F1/20;

  • 国家 JP

  • 入库时间 2022-08-22 03:33:59

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