The metal plated formation which is not generation of blistering is formed in Cu and the Cu alloy rolling material the manner

摘要

PURPOSE:To obviate the generation of a blister in a plating layer even if this layer is subjected to heating by polishing the surface of a rolled stock consisting of Cu to specific roughness, then applying metallic plating thereon. CONSTITUTION:The surface of the rolled stock consisting of the Cu and Cu alloy is polished to the surface roughness of =0.1mum center line average height (0.8mm cut off value) stipulated in JIS(Japanese Industrial Standards). The plating layer of Ag, Au, Ni, etc., is formed on this polished surface. The metallic plating layer which does not blister even when subjected to heating is formed in this way. This Cu and Cu alloy plated with the metal does not blister even when the Cu and Cu alloy is applied as a structural member to be exposed to high heat with an increasing trend toward the higher density and large size of semiconductor devices and, therefore, contribution is made to the improvement in the reliability.