METHOD FOR ELECTROCHEMICAL FABRICATION INCLUDING ETCHING TO REMOVE FLASH

摘要

An electroplating method that includes: a) contacting a first substrate (2)witha first electroplating article (4), which includes a support and a conformablemaskdisposed in a pattern on the support; b) electroplating a first metal from anelectroplating bath (58) which is a source of metal ions onto the firstsubstrate in afirst pattern, the first pattern corresponding to the complement of theconformablemask pattern; and c) removing the first article from the first substrate, isdisclosed.The method may be used in the microfabrication of miniaturized devices.Electroplating articles and electroplating apparatus are also disclosed.