OPTIMIZATION OF SiO2, FILM CONFORMALITY IN ATMOSPHERIC PRESSURE CHEMICAL VAPOR DEPOSITION

摘要

A chemical vapor deposition apparatus and method for forming an oxide thin film on a surface of a substrate. The system includes a reaction chamber having a support for holding a substrate and an injector positioned to inject gaseous substances into the reaction chamber. The injector includes a central injection port coupled to a source of ozone and at least two outer injection ports positioned on opposite sides of the central injection port and coupled to a source of chemical reagent. Ozone and chemical reagent are separately injected into the reaction chamber through the central injection port and outer injection ports, respectively, with the ozone and chemical mixing in the area between the injector and the substrate.