A vacuum microelectronic field-emission device comprises: a substrate (1); an emitter portion (2) formed to have at least a wedge portion extending in parallel to the substrate, the emitter portion being supported by the substrate; a gate portion (4) formed a first given distance apart from the tip of the emitter portion, the gate portion being supported by the substrate, the gate portion being electrically insulated (3) from the emitter portion; and a collector portion (5) formed a second given distance apart from a tip of the emitter portion, the collector portion being supported by the substrate, the second given distance is equal to or larger than the first given distance, the collector portion being electrically insulated (3) from the emitter portion and the gate portion.
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