How to manufacture a vacuum microelectronic device and a vacuum microelectronic device

摘要

The vacuum microelectronic device includes at least a cathode, an anode, and a grid attached within the cavity and formed by wafer bonding of two planar substrates. This technique allows a plurality of vacuum microelectronic devices (vacuum tubes) to be arranged on a single circuit board in an integrated manner such that a strong bond is formed, such as the circuit board itself.