the semiconductor package of the design as the third form of trim form system wrench

摘要

this invention is a semiconductor package of a package at the time of the third form of trim form system in the die holder.;the semiconductor package material (90) of the spring (93), the third time to the trim form system (1) of the third type wrench (30),the third type wrench (30) of the base (31) to the processing equipment. the ministry of supply (36) is the material (90) of the package (94) to support the edge part is fixed to a floating preventing means (32) and a spring (93) of the... when the card ud0a4uc9c0 (94) and spring (93) in the occurrence of the a solder plating and to the base (100) can be discharged to the base (31) for the packaging can (94) and the fixed interval gap (g) can be maintained. the equipment exhaust means (40) and a spring (93) of the pressure; the control points of the base (31) installed on shaft (60 the meeting, the cam (50) to prevent the rotor and shaft (60) and the cam (50), the contact area of the can in order to become a shaft (60) of the axis of the cam (50). the equipment to prevent rotor means (52) and the sea the term of fixed (BD).in order to combine with the base (31) of the groove (81), in a position of coupling means (80); including the design, the third material supply is placed at the position of the drum can be of the design work. at the same time, the ub192uc774ub294 to improve the design work. as the dye, in the base of the combination of easy to take effect.