Method for Evaluating Thermal Properties of Epoxy Molding Compounds

摘要

The method for evaluating the thermal properties of an epoxy molding compound (hereinafter referred to as EMC) according to the present invention includes the steps of manufacturing an EMC tablet, a process of preparing a sample by making the EMC tablet into powder, and It is a process to monitor the reaction energy characteristics and organic component decomposition characteristics of EMC by conducting a high temperature reaction which is gradually heated in a pan, so that 1) it is possible to review in advance the receipt of an abnormal product due to a change in formulation. As a result, process accidents caused by the use of abnormal products can be prevented, and 2) EMC storage conditions and process conditions can be optimized.