BGA package mounting structure of IC (IC) mounter

摘要

A nozzle head for adsorbing BGA package revolve, PCB has this by forming a corresponding groove, respectively by inserting the projection time of mounting into the groove if the ratio of the child's (IC) mountable group which may be accurately mounted to the mounting position A package relates to a mounting structure, the flange 11 is in the bottom face and each edge to a guide pin 12 projecting downward side, to which the guide pin 12 is inserted into the PCB (20) to which the BGA package 2 mounted to the configuration including the fixing groove (21).