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METHOD OF FLOATING-ZONE REFINING BY TEMPERATURE GRADIENT OF SILICON WAFERS BASED ON ALUMINUM ZONES

机译:基于铝区的硅片温度梯度浮区精炼方法

摘要

FIELD: semiconductor technology; applicable in manufacture of integrated circuits and semiconductor devices. SUBSTANCE: method includes recrystallization in nonstationary thermal fields of two-five gradient heaters by successive motion of silicon wafers from one heater to another without their switching off. In this case, one-two heaters raise the temperature up to 700-1200 C and the other heaters reduce the temperature down to 1000 Cl wafers are changed on adjacent heaters with their similar temperatures. Heaters temperature is recovered in the absence of silicon wafers. Duration of operation cycle of each heater is determined by mathematic dependence. EFFECT: higher efficiency. 5 dwg, 2 tbl
机译:领域:半导体技术;适用于集成电路和半导体器件的制造。实质:该方法包括在两个五个梯度加热器的非平稳热场中通过硅晶片从一个加热器到另一个加热器的连续运动而不关闭而重新结晶。在这种情况下,一两个加热器将温度升高到700-1200 C,另一个加热器将温度降低到1000 C1。在相邻加热器上以相似的温度更换晶片。在没有硅片的情况下恢复加热器温度。每个加热器的运行周期的持续时间取决于数学关系。效果:更高的效率。 5桶,2桶

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