A method of forming a spatial chip arrangement and spatial chip formation of inorganic

摘要

The invention relates to a process for forming a spatial chip arrangement with a plurality of chips (32, 36, 37, 38, 39) connected by electrical means to each other and arranged in different planes. The chips are connected via the peripheral connection surfaces (33) thereof to associated strip conductors (23) of a strip conductor structure (24, 25) arranged on at least one carrier substrate (21, 22) in that the chips are either arranged transversely to the longitudinal extension of the carrier substrate or parallel to the longitudinal extension of the flexible carrier substrate. The invention also relates to a spatial chip arrangement formed by said process.