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Electroplating procedure, a device for the production of a metal foil and is used in this case divided, insoluble electrode
Electroplating procedure, a device for the production of a metal foil and is used in this case divided, insoluble electrode
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机译:电镀程序,一种用于生产金属箔的设备,在这种情况下,使用不溶的分割电极
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PURPOSE: To continuously form a Cu foil with a uniform thickness and without pinholes on the surface of a cathode made of a metal rotary drum by immersing a rotary drum cathode and plural insoluble arc anodes provided on its periphery in Cu plating solution energize it. ;CONSTITUTION: A rotary drum 7 made of metal excellent in corrosion resistance, such as Ti and stainless steel is made a cathode. A plurality of insoluble electrode pieces 1 coated with Pt group metal or its oxide as an electrolytic catalyst are freely attachable and detachably fitted to an insoluble anode 10 by conductive bolts 3 on a back plate 5 made of the bulb metal such as Ti, Ta, Nb, Zr, etc. The insoluble anodes 10 are arranged along the curvature of the peripheral surface of the drum 7 with a constant spacing provided from the surface of the drum 7. Cu plating solution is fed from between the anodes 10 to the spacing between the cathode 7 and the anode 10 and is energized. Thereby the surface of the cathode rotary drum 7 is free from film defects, such as pinholes and abnormal deposits and a Cu foil 8 of high purity and a uniform thickness of ≤70μm is deposited on the drum 7 to wind it.;COPYRIGHT: (C)1993,JPO&Japio
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