Ultra-quiet, thermally efficient cooling system for forced air cooled electronics

摘要

A computer housing is provided with enhanced interior cooling, to dissipate operating heat from its heat generating internal electronic components, using a single cooling fan disposed inside the housing. During operation thereof the fan draws ambient cooling air into the housing through a hollow support foot attached to the underside of the housing, and the bottom end opening of a hollow front bezel structure, flows the cooling air through the housing and then discharges it therefrom. A pull-out option card carrier defines an interior housing baffle that routes a large portion of the interior housing air flow across the processor portion of the computer motherboard. Additionally, a smaller quantity of ambient cooling air is drawn through side wall openings in the housing into an interior plenum upon the inner side wall of which the motherboard is mounted. The plenum air is passed into the main housing interior through a transfer opening in the inner side wall and then drawn along the balance of the motherboard through a gap between the motherboard and the installed option card carrier.