RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, AND LAMINATE FOR PRINTED CIRCUIT BOARD, LAMINATE FOR MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE OF BALL GRID ARRAY TYPE PREPARED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a resin compsn. for printed circuit boards which gives a cured item having resistances to heat and moisture, adhesive power, and resistance to soldering heat. ;SOLUTION: This compsn. is prepd. by compounding (a) a cyclopentadiene epoxy resin of the formula (wherein 1 is an integer of, on average, 0-3), (b) tetrabromobisphenol A, (c) a phenol resin excluding tetrabromobisphenol A, and (d) a cure catalyst for accelerating the reaction of epoxy group with phenolic hydroxyl group, the amt. of tetrabromobisphenol A compounded being 30-38 wt.% of the compsn.;COPYRIGHT: (C)1999,JPO