SEALING DEVICE AND METHOD USEFUL FOR CONNECTION BETWEEN MATERIALS HAVING THERMAL EXPANSION DIFFERENCE IN SEMICONDUCTOR PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To enable processing for a substrate under incomplete vacuum by sealing between two parts operated with different pressure to place a support platform under such pressure as to enable thermal transfer using a thermal transfer means. ;SOLUTION: A substrate support platform 102 is so constructed that a first plate of a capacitor is formed by a non-magnetic semiconductor or a conductive substrate 104, a dielectric inner layer is a part of an upper flat plate 106, and a second conductive plate is fed with a conductive layer 111 inside the flat plate 106. The substrate 104 is cooled by cooling the flat plate 106 by a cooling coil 118. Further, a second heat transfer fluid is moved by a conduit 128. A processing chamber enclosing the substrate 104 is under the partial vacuum condition such that the absolute pressure is frequently 0.1 mTorr, and to prevent heat transfer, it is necessary to provide a third heat transfer fluid between the cooling coil 118 and the flat plate 106. Then, a sealing means 138 seals between the conduit 128 and the flat plate 106, and a sealing means 140 seals between a support platform housing 108 and the flat plate 106.;COPYRIGHT: (C)1999,JPO