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METHOD FOR SOLDERING FLEXIBLE PRINTED WIRING BOARD AND SOLDERING JIG

机译:柔性印刷线路板的焊接方法和治具的焊接方法

摘要

PROBLEM TO BE SOLVED: To provide a method for soldering a flexible printed wiring board, wherein durability and rigidity of a substrate supporting holder are improved while occurrence of non-soldered state is effectively prevented. ;SOLUTION: A substrate support holder 21 comprises a jig main body 21a formed of a thin wall-thickness metal plate material and a heat-insulating material layer 21b covering a solder surface side of the jig main body 21a. When a terminal 16 is soldered by comprehensive soldering method to a land 18 formed on a flexible printed wiring board 11, the substrate support holder 21 is made to contact the soldering surface side of a substrate 12, so that the land 18 and the terminal 16 are positioned at an opening part 23 of the substrate support holder 21, and under the contact state, soldering is performed by the batch soldering method.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:提供一种用于焊接挠性印刷线路板的方法,其中,在有效地防止非焊接状态发生的同时,提高了基板支撑架的耐久性和刚性。 ;解决方案:基板支撑架21包括由薄壁厚度的金属板材形成的夹具主体21a和覆盖夹具主体21a的焊料表面侧的绝热材料层21b。当通过综合焊接方法将端子16焊接到形成在柔性印刷线路板11上的焊盘18时,使基板支撑支架21接触基板12的焊接表面侧,从而焊盘18和端子16在基板支撑架21的开口部23处,以接触方式通过分批焊接法进行焊接。COPYRIGHT:(C)1999,JPO

著录项

  • 公开/公告号JPH11163514A

    专利类型

  • 公开/公告日1999-06-18

    原文格式PDF

  • 申请/专利权人 SUMITOMO WIRING SYST LTD;

    申请/专利号JP19970321358

  • 发明设计人 NAKAMURA ATSUSHI;MURAKAMI HIROSHI;

    申请日1997-11-21

  • 分类号H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-22 02:37:03

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