首页> 外国专利> POLISHING DEVICE OF COMMON CONDUCTOR FOR ELECTROLYTIC REFINING EQUIPMENT AND PICKLING DEVICE OF COMMON CONDUCTOR FOR ELECTROLYTIC REFINING EQUIPMENT

POLISHING DEVICE OF COMMON CONDUCTOR FOR ELECTROLYTIC REFINING EQUIPMENT AND PICKLING DEVICE OF COMMON CONDUCTOR FOR ELECTROLYTIC REFINING EQUIPMENT

机译:电解精制设备通用导体的抛光装置和电解精制设备通用的酸洗装置

摘要

PROBLEM TO BE SOLVED: To provide a polishing device or pickling device for common conductors for electrolytic refining equipment capable of continuously and automatically polishing or pickling the sections for supporting the anode lugging molds or cathode starting plates of the common conductor installed on the side walls partitioning adjacent electrolytic cells of the electrolytic refining equipment to improve the electrolytic efficiency. SOLUTION: The polishing device of the common conductors 31 is constituted to polish the sections supporting the anode lugging molds or the cathode starting plates of the common conductors installed on the side walls 30a partitioning the adjacent electrolytic cells of the electrolytic refining equipment by a polishing means 12 while injecting dilute sulfuric acid or an electrolyte just prior to the placement of these anode lugging molds or the cathode starting plates. Since the polishing is executed just prior to the placement, the placing of the anode lugging molds or the cathode starting plates on the surfaces right after the polishing is made possible and the conduction defect may be averted. In addition, the polishing is executed while the dilute sulfuric acid or the electrolyte is injected and, therefore, the surfaces having the higher electrical conductivity are formed by dissolving the adhered solid metal salts, polishing dust or the like and the simultaneous replenishment of the acid in the electrolytic cells is made possible by returning the acid to the electrolytic cells.
机译:解决的问题:为电解精制设备提供一种用于普通导体的抛光装置或酸洗装置,该装置能够连续自动地抛光或酸洗用于支撑安装在侧壁分隔壁上的用于普通导体的阳极凸模或阴极起始板的部分电解精制设备的相邻电解池,以提高电解效率。解决方案:公共导体31的抛光装置的结构是通过抛光装置抛光支撑安装在分隔电解精制设备的相邻电解池的侧壁30a上的公共导体的阳极模或阴极起始板的部分。如图12所示,同时恰好在放置这些阳极承拉模具或阴极起始板之前注入稀硫酸或电解质。由于刚好在放置之前进行抛光,因此可以在抛光之后立即将阳极支承模或阴极起始板放置在表面上,并且可以避免导电缺陷。另外,在注入稀硫酸或电解质的同时进行抛光,因此,通过溶解附着的固体金属盐,抛光粉等,并同时补充酸来形成具有较高电导率的表面。通过将酸返回到电解池中,可以使电解池中的有机硅成为可能。

著录项

  • 公开/公告号JPH11172485A

    专利类型

  • 公开/公告日1999-06-29

    原文格式PDF

  • 申请/专利权人 NIPPON MINING & METALS CO LTD;

    申请/专利号JP19970361723

  • 发明设计人 MATSUMOTO SHINGO;

    申请日1997-12-05

  • 分类号C25C7/02;

  • 国家 JP

  • 入库时间 2022-08-22 02:35:57

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