The present invention relates to a lens processing apparatus for adjusting light output from a semiconductor laser device (10) to a desired optical characteristic. The lens (12) is located at one end of the semiconductor laser element (10), and the optical characteristic of the lens is measured by the wavefront measuring instrument (16) by the transmitted light. The machining laser beam is focused onto the lens surface via a beam splitter (14). The position adjusting device 22 adjusts the relative positional relationship between the lens surface and the focusing position of the machining laser beam, and the lens surface is processed in this state. The ultraviolet laser 18 and the position adjustment device are controlled by a control arithmetic unit 24. In the control operation apparatus, the processing data of the wavefront measuring instrument is used to calculate machining data to bring the light passing through the lens to the desired optical characteristic. This processing enables optical characteristics such that the transmitted light of the lens becomes a true circle.
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